1000ct 200g Diamond Micron Powder Ultra-fine Precision Lapping Polishing Compound for Jewelry Molds Thermal Conductive Material

Synthetic Diamond Micron Powder (1000ct / 200g)

Produced via advanced static pressure synthesis and strict precision classification technology, this industrial monocrystalline synthetic diamond micropowder features high chemical purity (>99.5%), tightly controlled particle size distribution, extreme thermal conductivity, and superior cutting efficiency. Engineered for precision lapping, ultra-fine polishing, slurry formulation, and thermal management material processing.

Technical Specifications

• Product Type: Monocrystalline Synthetic Diamond Micron Powder / Lapping Compound
• Abrasive Material: Synthetic Diamond (Purity > 99.5%, Mohs Hardness 10)
• Sanding & Polishing Application: Precision lapping, ultra-fine surface polishing, semiconductor wafer thinning, and mold finishing
• Suitable Materials: Semiconductor substrates (SiC, GaN, Sapphire), technical ceramics (AlN, Zirconia), optical glass, tungsten carbide, gemstones, and hardened metals
• Net Weight / Quantity: 200 g (approx. 1,000 carats)
• Particle Morphology: High-strength monocrystalline blocky particles with consistent micro-fracturing self-sharpening behavior
• Thermal Conductivity: High thermal dissipation to prevent workpiece micro-cracking during high-speed lapping

Grit Size & Micron Classification Guide

• Coarse Grinding & Stock Removal: 100/120 (100#), 230/270 (240#)
• Coarse Polishing & Pre-Finishing: W50 (400#), W40 (500#), W28 (600#)
• Medium Polishing & Precision Lapping: W20 (700#), W14 (800#), W10 (1000#), W7 (2000#)
• Fine Polishing & High Luster: W5 (3000#), W3.5 (5000#), W2.5 (7000#)
• Mirror Finishing & Superfinishing: W1.5 (10,000#), W1.0 (13,000#), W0.5 (15,000#)

Key Characteristics

• Extreme Hardness & Cutting Rate: Mohs hardness 10 provides high stock removal rates and minimal abrasive consumption on hard and brittle workpieces.
• High Purity & Chemical Inertness: Purity exceeding 99.5% prevents contamination in semiconductor, optical, and laboratory environments.
• Tight Particle Size Distribution: Strict grading prevents stray oversized particles, eliminating random surface scratches.
• Controlled Self-Sharpening: Uniform crystal cleavage continually regenerates fresh cutting points for consistent roughness throughout processing.

Recommended Applications

• Ultra-Precision Polishing: Sapphire windows, silicon carbide (SiC), gallium nitride (GaN), technical ceramics, optical lenses, and semiconductor substrates.
• Thermal Interface Materials: Polishing diamond heat spreaders, aluminum nitride (AlN) components, and high-conduction heat sinks.
• Abrasive Tool Manufacturing: Formulating diamond polishing pastes, slurries, liquid suspensions, resin-bonded laps, and electroplated tooling.
• Industrial Tooling & Mold Polishing: Precision finishing of carbide drawing dies, injection molds, mechanical seals, watch components, and gemstone faceting.